OHT Overhead Transport Vehicle - Semiconductor OHT Overhead Crane - Semiconductor AMHS Integrated Solution - Semiconductor Automated Handling System - Automatic Material Handling and Storage - Gechua

Pain Points

1. Semiconductor production process is complex, with intricate process flows

IC production requires cyclic flow between different process areas, with strict control over materials and Q Time, making logistics management very difficult

2. Semiconductor process equipment has many types and is expensive, need to improve utilization rate

Semiconductor equipment investment accounts for over 80%, need to reduce idle time of process equipment, improve utilization rate to increase capacity

3. Semiconductor production workshop has high cleanliness level

Semiconductor clean room requires high cleanliness, need to minimize the number of people in the workshop, reduce dust generation, improve product yield

4. Manual handling has a great impact on production efficiency and product yield

Human handling errors lead to product scrap, untimely manual handling and large vibrations during the process directly affect production efficiency and product yield

User Value

Improve Production Efficiency

OHT can quickly transport and cache products between process areas, improve process equipment utilization rate, thereby improving production efficiency

Reduce Labor Costs, Reduce Pollution

The introduction of OHT automated handling significantly reduces workshop labor costs, while reducing the risk of workshop pollution from too many people

Save Space

OHT is suspended under the ceiling, does not occupy floor space, improves workshop space utilization

Improve Reliability

OHT has stable and reliable high-efficiency operation, ensuring the continuity of the workshop production process

Core Advantages

Meet the handling needs of semiconductor front-end and back-end, different size wafers
Has multiple OHT models to meet semiconductor front-end and back-end scenarios; covering 6”/8”/12” wafer and Magazine cassette applications
Excellent performance, achieving high-efficiency logistics handling
Super capacitor equipped: When HID PSP power cabinet is abnormal, OHT can use its own capacitor to continue actions, avoiding impact of power interruption on production; special track design for areas like fire doors, one-click opening and closing, improving operation efficiency; material transport safety: handling accuracy controlled within ±1mm, vibration value during handling <0.5G, multiple protections in key pick-and-place processes, greatly reducing wafer damage risk; PCB intelligent control: high modularity, strong reliability; embedded Layout map: achieves logical judgment during vehicle operation, saves data interaction between OHTC/OHT
Self-developed, self-supply chain, fast delivery
Self-developed investment, self-control ratio 95%+; established self-supply chain matrix, ensuring core component delivery
Easy installation, simple operation, saves user maintenance time and cost
Flexible architecture, focus separation, convenient module combination and decomposition, greatly shortening installation time; key components are not customized, providing high reusability and maintainability, greatly reducing maintenance time and cost

Application Scenarios

Wafer Transport

In wafer fab process manufacturing flows like lithography, etching, quickly and safely transfer wafers, improving wafer fab production efficiency and process control capability

Large Wafer Transport

Achieve precise positioning, rapid transfer, and reliable handling of large wafers, ensuring material safety and stability

Packaging and Testing Logistics Automation

Ensure that wafer processes like Bumping, TSV extend to Tray Plat, improving back-end packaging and testing logistics handling and production efficiency

Cases

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Semiconductor Wafer Handling Success Case

Project background: The customer is an important high-end core electronic device supply base and semiconductor new device technology innovation base in China. The project is based on the customer's goal of building the first batch of the most advanced domestically self-developed wafer handling systems in the semiconductor field, providing integrated solutions including aerial material transmission, human-machine collaboration, data transmission, etc.

Solution: Professional and experienced original AMHS team, specially understand customer pain points and needs, efficiently customize exclusive material handling solutions
Provide ceiling-mounted track layout for the customer, and adopt bidirectional OHB structure; fully consider the coordination between transmission paths of different processes in the customer's factory, improve overall space utilization and equipment utilization rate
The entire AMHS system includes many hardware equipment and software for handling, communication, storage, etc., covering the entire semiconductor front-end process, fully considering the customer's material handling needs in tight spaces to provide integrated solutions

Value benefits: Material transmission efficiency improvement
Human-machine collaboration improvement
Data security improvement

Functional Modules

Carried cassettes: 12” FOUP, 6”/8” SMIF Pod, Metal CST

Usage scenarios: Front-end Foundry, DRAM, Flash process workshops
Back-end Bumping, TSV, WLP process workshops

Vehicle bottom/ceiling spacing: 1100mm

Carried cassettes: Magazine

Usage scenarios: Back-end process Die Bonding workshop; workshop height 2.7m, can ensure >2.0m clearance under the overhead crane

Vehicle bottom/ceiling spacing: 690mm

Carried cassettes: Magazine

Usage scenarios: Back-end process Die Bonding workshop; workshop height 2.5m, can ensure >2.0m clearance under the overhead crane

Vehicle bottom/ceiling spacing: 490mm