Getech Case | Smart Manufacturing Upgrade, CIM Solution Enhances 'Chip' Factory Competitiveness
One of the earliest semiconductor packaging companies in China, with sensor packaging and testing technology at an internationally leading level. To meet current and future business development needs and promote the informatization, standardization, and scientization of production process management, the company requires digital construction to achieve full-process control covering SMT and IC packaging production, real-time, accurate, and effective collection and processing of production data, ensuring 'production data can be collected and management directives can be executed'.
Building an MES system to achieve full production process management and traceability. By integrating with equipment systems to automatically read substrate IDs, it enables process traceability at the substrate ID granularity; temperature-sensitive material system management, controlling production material Q-time to prevent quality issues caused by abnormal material usage.
Building an EAP system to enable real-time data communication between MES and equipment, achieving dynamic equipment status monitoring and abnormal parameter alarms; through the EAP system, automatic reading of carrier IDs is realized, enabling process Auto track in/track out; EAP system integrates wafer map, enabling automatic and accurate Download of wafer map by the equipment system; EAP system integrates RMS, enabling equipment recipe body system comparison to prevent production abnormalities caused by manual recipe errors.
Building an SPC system to automatically parse inspection equipment data, generate control charts in real time, and coordinate with relevant systems to handle abnormal production batches.
Through integration with ERP, OA, and other systems, the role of MES and EAP as a bridge is fully utilized to achieve data sharing, preparing the platform and data for future intelligent equipment control and big data analysis applications.
● WIP status tracking: Real-time tracking and monitoring of the status of WIP being processed on equipment. ● Equipment status monitoring: Real-time monitoring of equipment status to improve equipment utilization. ● Alarm management: Real-time alarm notifications for equipment failures. ● Recipe management: The equipment automation system judges each batch and instructs the equipment to use the corresponding recipe for processing. ● Data collection: Collecting equipment operating parameters and real-time monitoring of abnormalities in DB/WB/AOI and other equipment.
Relying on the new smart manufacturing plan, the company has achieved leapfrog improvements in product quality, production efficiency, and cost reduction:
1. Shorten delivery time
Cycle time increased by 20%, enabling intuitive display of capacity and plans, real-time grasp of production progress, precise control of the production process, ensuring production, and improving equipment operational efficiency.
2. Improve quality
Expected to reduce human-caused quality accidents by over 90% due to misoperation, Q-Time overtime, recipe errors, personnel qualifications, etc., and provide a complete quality traceability chain;
Collect Process data of WIP at various process equipment;
Collect (configurable) abnormal data from equipment to facilitate analysis of abnormalities.
3. Improve production efficiency
Ensure smooth interoperability of WIP processes, real-time insight into upstream and downstream conditions;
Control equipment and production flow, ensuring the production process is not affected by upper system abnormalities;
Integrate and convert data from entire line equipment, reducing the burden on upper systems.
4. Reduce costs
Assist in managing the input and output of all products on equipment;
Together with MES, achieve automatic accounting of WIP materials, thereby reducing the human-machine ratio, real-time grasp of equipment status, and quick resolution of abnormal causes.
