Recently, as a bellwether for the integrated circuit industry, the 22nd China Semiconductor Packaging and Testing Technology and Market Annual Conference - 6th Wuxi Taihu Core Innovation Forum was successfully held in Wuxi, Jiangsu. The event discussed hot topics like advanced packaging technology, processes, equipment, key materials, innovation, and investment, offering a feast of ideas. On the afternoon of September 25, Yang Fan, an expert from Getech Dongzhi's Semiconductor Business Unit, was invited to the Advanced Packaging and Testing Technology Forum and delivered a keynote speech titled 'Domestic CIM Helps Advanced Packaging Meet Challenges and Opportunities', contributing domestic CIM solutions for advanced packaging.
As known in the industry, semiconductor chips undergo 'front-end' wafer manufacturing and 'back-end' packaging and testing. Driven by demands like AI and HPC, advanced packaging has emerged, using high-density methods to meet needs for more pins, smaller systems, and higher integration, significantly improving performance while reducing wafer manufacturing costs and barriers.Unlike traditional back-end packaging, advanced packaging lies at the intersection of wafer manufacturing and testing, forming a unique 'mid-end' process. By 2025, China's advanced packaging market is predicted to reach billions, with a share exceeding 50% for the first time, surpassing traditional packaging.
As a deep-rooted industrial intelligence solution provider in the semiconductor industry, Getech Dongzhi has提前布局ed early. To meet the special management needs of advanced packaging's 'mid-end process', Getech Dongzhi has independently developed and launched G-MES 3.0 based on back-end G-MES 1.0 and front-end G-MES 2.0: it shares a data foundation with G-MES 1.0 & 2.0 (enabling version upgrades) and adds many features for advanced packaging needs. Additionally, G-MES 3.0 excels in data integration and sharing, connecting multiple systems, integrating and sharing diverse data, enabling system consolidation and custom功能拓展. Based on this, Getech Dongzhi can provide tailored G-CIM overall solutions for advanced packaging customers.
In specific applications, Yang Fan further explained that the solution offers flexible modeling for small-batch trial production; multi-dimensional monitoring of equipment CMK with instant alerts for deviations; Smart Bond to reduce Wafer bond waste. For some advanced packaging customers facing long process chains and complex quality issues in vertical产业链, Getech Dongzhi provides full-process quality management services from R&D to after-sales.
Looking at Getech Dongzhi's past achievements in semiconductor services, it has successfully helped dozens of clients complete software and hardware projects with 0 delays, 0 failures, and 100% delivery success. This capability stems from strong talent accumulation and R&D investment. Currently, Getech Dongzhi's Semiconductor BG includes experts from top global semiconductor firms, with 400+ dedicated staff and 500+ resource pool, with over 50% R&D focus.
In the future, Getech Dongzhi will continue to focus on R&D innovation for full industrial chain intelligent solutions in semiconductors, benchmark against international leaders, improve product systems, accelerate scene intelligence, and lead the domestic CIM field.
