Live at the Packaging and Testing Annual Conference: Getech Shares Domestic CIM Solutions for Advanced Packaging
2024-09-27
Recently, the 22nd China Semiconductor Packaging and Testing Technology and Market Annual Conference—the 6th Wuxi Taihu Core Innovation Forum, a bellwether for the integrated circuit industry, was successfully held in Wuxi, Jiangsu. The conference brought together experts to discuss hot topics such as advanced packaging technology, processes, equipment, key materials, innovation, and investment, offering a feast of ideas for the audience. On the afternoon of September 25, Yang Fan, an expert in the packaging and testing industry from Getech’s Semiconductor Division, was invited to speak at the Advanced Packaging and Testing Technology Forum and delivered a keynote speech titled "Domestic CIM Empowers Advanced Packaging to Embrace Challenges and Opportunities," contributing domestic CIM solutions for advanced packaging to the industry.
As widely known in the industry, semiconductor chips undergo two major processes: "front-end" wafer manufacturing and "back-end" packaging and testing. In recent years, driven by demands such as AI and HPC, advanced packaging has emerged. Through high-density packaging, it meets the needs of chips with a high number of pins, smaller chip systems, and high integration, significantly improving chip performance while greatly reducing the threshold and cost of wafer manufacturing. Unlike traditional back-end packaging and testing processes, advanced packaging lies at the intersection of wafer manufacturing and packaging and testing processes, forming a unique "mid-end" process. It is predicted that by 2025, China's advanced packaging market will reach a scale of hundreds of billions, with a market share exceeding 50% for the first time, surpassing traditional packaging.In response, as an industrial intelligence solutions provider deeply rooted in the pan-semiconductor industry, Getech has long made early preparations. To meet the special management requirements of the "mid-end process" in advanced packaging, Getech independently developed and launched G-MES 3.0 based on the back-end G-MES 1.0 and front-end G-MES 2.0. It not only shares a data foundation with G-MES 1.0 & 2.0 (enabling upgrades and expansions across versions) but also adds numerous features tailored to the specific needs of advanced packaging. Additionally, G-MES 3.0 excels in data integration and sharing, effectively connecting multiple systems, integrating and sharing diverse data, achieving consolidation of multiple systems, and enabling customized functional expansions. Based on these new technological developments, Getech can provide a complete set of G-CIM overall solutions tailored for advanced packaging customers.
In terms of specific applications, Yang Fan further explained that this solution features flexible modeling methods supporting small-batch trial production; multi-dimensional monitoring of equipment CMK with instant alerts for capability deviations; reducing Wafer Bond waste through Smart Bond. For some advanced packaging customers facing challenges such as long process chains and complex quality improvements in full-process vertical industry chains, Getech offers full-process quality management system construction services, covering product development, mass production, quality improvement, and after-sales support.
Looking back at Getech’s track record in the semiconductor field, the company has successfully helped dozens of semiconductor customers complete software and hardware project deliveries with 0 delays, 0 unfinished projects, and a 100% delivery success rate. This capability stems from the company’s strong talent pool and R&D investments. To date, Getech’s Semiconductor BG has brought together industry experts from leading semiconductor companies at home and abroad, with a team of 400+ semiconductor specialists and 500+ resource pool support, with R&D accounting for over 50% of related efforts.In the future, Getech will continue to focus on R&D and innovation in industrial intelligence solutions for the entire semiconductor industry chain, benchmark against international leading manufacturers, continuously improve its product system, accelerate scenario intelligence, and stand at the forefront of domestic semiconductor CIM.
