Unveiling Advanced Packaging CIM High-Score Answers, GETECH Meets You at 2025 China Semiconductor Advanced Packaging and Testing Conference
On October 22, the '2025 China Semiconductor Advanced Packaging and Testing Conference and 2025 China Semiconductor Wafer Manufacturing Conference', regarded as an industry development bellwether, will kick off in Kunshan, Jiangsu. The conference gathers global semiconductor experts, scholars, business leaders, and other stakeholders to discuss the core theme 'Wafer manufacturing is the foundation, advanced packaging is the breakthrough direction'. It will release new wafer manufacturing processes, Chiplet architecture, and other cutting-edge achievements, and address industry pain points like efficiency under equipment constraints and advanced packaging bottlenecks through forums, attracting over 500 leading companies for cooperation.
Yang Jun, head of GETECH's advanced packaging and testing business, is invited to attend and will deliver a keynote speech titled 'From Automation to Autonomy: The New Generation Evolution Path of AI-Enabled Advanced Packaging CIM', sharing his practical experience and insights. Meanwhile, as a leading industrial intelligence enterprise focusing on semiconductor digital transformation, GETECH will showcase advanced packaging and testing product solutions and results at booth A008. We look forward to your visit to grasp industry trends and explore future directions together!
